MiNaLab cleanroom laboratory
SINTEF has 800 m² of clean room area in the MiNaLab building. The laboratory is designed for a throughput of 10 000 4-layer wafers per year.
We do single and double sided wafer processing of 100 and 150 mm wafers. The devices have up to 17 mask layers, and our smallest line widths are around 0.8 µm. The general clean room area is of class 1000, and mini environments around sensitive processes are of class 10. The cleanroom contains a complete silicon processing line, including wet and dry bulk etching of silicon and wafer bonding. In addition, the laboratory has a separate area designated for materials that are not CMOS compatible. A supplementary list of our laboratory equipment and processes is found at the bottom of this page.
The SINTEF cleanroom is co-located with the 600 m² cleanroom of the department of physical electronics at the University of Oslo, on the lower floor of the MiNaLab building.
Contact person: Trond Hansen
| Process | Description | Equipment |
| High temperature processes | Oxidation, Diffusion, Annealing. Deposition of P and B, LPCVD of Si3N4 and polysilicon | Centrotherm diffusion furnaces |
| RTP | Rapid temperature processing up to 1250oC in Ar, N2, O2 or forming gas. | AS-Master 2000 (Annealsys) |
| Metal deposition | Al, Ti, W, NiCr and Au | MRC metal sputter |
| Photolithography | Thin and thick resists, polyimide, double sided coating, and edge handling. Contact and proximity printing. Front-to-back side alignment. Automatic pattern inspection. | Resist coaters (SUSS and SSE)
Mask aligners (SUSS)
Automatic inspection NSX95 (August Technologies)
|
| Dry etching (RIE) | Etching of Si, polysilicon, SiO2, Si3N4, and polymers. High aspect ratio etching of silicon. | AMS200 I-Productivity (Alcatel) |
| Bulk wet etching of Si | KOH, TMAH and EDP | Stangl wet benches |
| Wafer bonding | Anodic, adhesive and direct wafer bonding. | MA6, SB6 and SB6-e (SUSS) |
| Dicing | Dicing of silicon, glass, and bonded wafer stacks | DAD321 (Disco) |
| Wire bonder | Au balls for bumping and wire bonding | Kulicke & Soffa 4522 |
| Electrical characterisation | Automatic and manual probe stations | |
| Characterisation | Optical microscopes, scanning electron microscope with EDS, white light interferometer, ellipsometer, profilometer, 4-point probe. | Leitz Ergoplan,
FEI Quanta 600 FEG, Zygo New View 6300, Rudolph Research AutoEL IV, Veeco FPP5000 |
Non-CMOS compatible materials (Au, glass, PZT, and more):
| Process | Description | Equipment |
| Dry etching | Etching of Si, polysilicon, SiO2, Si3N4, and polymers. High aspect ratio etching of silicon. | AMS200 I-Speeder (Alcatel) |
| Photolithography | Photolithography of Au, PZT and Pt | SUSS MA150 |
| Glass processing | Wet bulk etching of glass | |
| Critical point dryer | Stiction-free drying of MEMS, drying of porous samples, cleaning | Tousimis 915B |
