Core competence and services
- Die attach and flip-chip bonding
- Metal based/conductive adhesives/composite joints
- Design issues: thermal conductivity/ mechanical compliance
- Assembly on/in textiles
- Reliability studies and failure analysis
- Mechanical, thermo-mechanical and flow simulations
- Advanced multiphysics simulations (thermal-flow, non-linear structural mechanics, thermal stress)
- Thermal shock cycling (-70°C to +220°C)
- Low and high temperature storage (-70°C to +220°C)
- Climate chamber testing (-75°C to +180°C)
- Shear/pull testing (Dage 4000 PLUS, Minimat 2000)
- Balling/reballing (Martin reballer)
